Scaling of InGaAs MOSFETs into deep-submicron

We have demonstrated high-performance deep-submicron inversion-mode InGaAs MOSFETs with gate lengths down to 150 nm with record Gm exceeding 1.1 mS/μm. Oxide thickness scaling is performed to improve the on-state/off-state performance and Gm is further improved to 1.3 mS/μm. HBr pre-cleaning, retro-grade structure and halo-implantation processes are first time introduced into III-V MOSFETs to steadily improve high-k/InGaAs interface quality and on-state/off-state performance of the devices. We have also demonstrated the first well-behaved inversion-mode InGaAs FinFET with ALD Al2O3 as gate dielectric using novel damagefree etching techniques. Detailed analysis of SS, DIBL and VT rolloff are carried out on FinFETs with Lch down to 100 nm and WFin down to 40 nm. The short-channel effect (SCE) of planar InGaAs MOSFETs is greatly improved by the 3D structure design. The result confirms that the newly developed dry/wet etching process produces damage-free InGaAs sidewalls and the high-k/3D InGaAs interface is comparable to the 2D case.